Phase 2 - Flooring Replacement at Andrew, Sandburg, and Stagg High Schools

Each bid must be accompanied by a Bid Guarantee in the form of a Bid Bond, Certified Check or Bank Draft in an amount equal to and not less than ten percent (10%) of the bid and made payable to School Board, Consolidated High School District 230, Orland Park, Cook County, Illinois. No bid shall be withdrawn for a period of thirty (30) days after the bid opening date without the consent of the Owner. Checks or drafts of unsuccessful Bidders will be returned as soon as practical, after opening and checking the bids. Successful Bidder must provide a Performance Bond and a Labor and Material Payment Bond in the full amount of the Contract, acceptable to the Owner. Bids shall be submitted in an opaque sealed envelope clearly marked as SEALED BID and addressed to: Mr. David Keating Director of Facilities Consolidated High School District 230 15100 S. 94th Ave. Orland Park, IL 60462 The School Board reserves the right to reject any or all bids or parts thereof or waive any irregularities or informalities in bidding. All Bidders must comply with applicable Illinois Law requiring the payment of prevailing wages by all contractors working on public works. QUALIFICATION: Each Bidder must satisfactorily complete the qualification process described in Section 010000-General Requirements of the Project Manual, by providing the required Qualification Documents. The required Qualification Documents must be delivered along with the Bidder's sealed bid at the same place and time required for the bid. Contents of each Bidder's Qualification Documents will be available for public review. There shall be only one scheduled walk-through of the sites. Attendance shall be taken at the sites to ensure that all contractors and subcontractors have visited the site. Non-attendance can be grounds for rejection of bid. Bid Result. Base Bid 1: TSI Commercial Floor Covering $517,933.00 Base Bid 2: TSI Commercial Floor Covering $488,765.00

Division 09 -

Finishes, Flooring.